P‐8.2: Fabrication of ultrahigh‐resolution Micro‐LED display by flip‐chip bonding

Abstract

Micro‐LEDs are considered as one of the most promising candidates for next‐generation display application, because Micro‐LEDs have advantages in high resolution, high luminous efficiency, brightness, and long operating lifetime. These features make them the most promising platform in high‐end display applications, especially for AR/VR displays which requires a 1500ppi because of the human natural eye resolution acuity of about 60 pixels per degree. In this work, we have fabricated ultrahigh resolution (5000 PPI) Micro‐LED displays utilizing flip‐chip bonding technique to obtain exquisite results.