Abstract
AbstractIn this article, the mura issue of LCD panel induced by LGP warpage in high temperature and high humidity (HTHH) environment is discussed. From experiments, it is validated that insufficient gap between LGP and plastic mold frame, housing, will lead to deform the LGP. Due to the LGP has high moisture absorption and low thermal stability characteristics, it is easy to have volume expansion occurred. Obviously, the elongation of LGP will compress housing, thus LGP warping causes mura while panel in display mode. Experimental design (DOE) method is thus performed to generate a mathematical model to predict the displacement of LGP caused by hygrothermal effect. Finally, from experiment results, it is approved that the mura phenomenon has been eliminated. Furthermore, the mathematical construction model can provide the suitable design tolerance in module design phase.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
