P‐71: Methods for Adopting High Resolutions Mobile Displays in Alternative Applications, Products and Markets

Abstract

Mobile displays are overcoming bandwidth hurdles of low cost chip‐on‐glass DDIC manufacturing. Using VESA DSC and MIPI C‐PHY achieves over 6x of additional throughput compared to traditional MIPI D‐PHY interfaces and is driving the next generation of mobile devices, VR/AR headsets and immersive automotive consoles providing higher resolution and frame rate at lower cost and power. Using FPGA/ASSP bridging devices with VESA DSC and MIPI C‐PHY support overcomes the adoption challenges of D‐PHY and eDP based SoCs along with cabling interfaces such HDMI, DP and A‐PHY will be discussed.