Abstract
In this paper, the metal adhesion of metal trace structure and line‐width size on the organic film (insulating OC material) for touch panel was studied. At present, pure aluminum and pure copper processes can achieve the low cost and high performance requirements of the touch panel design. The influencing factors of pure aluminum trace’s adhesion on organic film were studied: ➀there was no significant difference in the comparative pull‐out force between OC and inorganic film on the 3M tape used for cross‐cut test; ➁the stress directivity of the organic film and the inorganic film was tested on silicon wafer, and the adhesion mechanism was analyzed;➂ the effect of different line widths and structure on adhesion was test; ➃in order to achieve the adhesion of metal trace in the touch panel (≧4B), it is necessary to optimize the structure designed of the organic insulating layer and SiNxOy layer.
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