Abstract
COG) interconnections require finer pitch to han- dle denser displays with more integrated driver chips, particularly for mobile devices. We report recent developments utilizing tiny micro-machined springs to replace ACF (anisotropic conductive film). Liquid, ultraviolet light-cured adhesives permit the attach- ment of chips to the glass without heating. We fabricated and tested daisy chain test vehicles with 800 spring contacts on 20 µm pitch.
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