Abstract
AbstractRecently the use of Copper as a conductor material for Thin Film Transistor (TFT) structures has received increasing attention in the Flat Panel Display industry [1, 2].Since sputtering of thick Cu layers has serious disadvantages Flat Panel Display (FPD) manufacturers are considering wet chemical Cu deposition as a viable process alternative. Depending on the required film properties like conductivity and surface roughness either electroless or electrolytical Copper deposition can be applied.
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