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Abstract
Long life time and high mechanical strength of organic light emitting diode (OLED) can be achieved via located heating glass frit by near infrared laser exposure. In this paper, influence of laser sealing process on frit hermetical performance is investigated. Rough surface of frit after laser scan may lead to the defect called frit mura, which is proved to decrease the adhesive strength of OLED device. It is found that low power of laser scan can alleviate frit mura. However, the real seal width is small, which is not expected for high hermeticity and mechanical strength. Thus, optimal double laser scan process is presented.
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