Abstract
AbstractIn this work, we have improved new tubeless packaging technologies using an indirect glass‐to‐glass electrostatic bonding and an organic binder bonding to the PDP. Both methods were performed more at less temperature than 200°C. AC‐PDPs were successfully packaged in He‐Ne(27%)‐Xe(3%) and the packaging properties were compared with conventional method. We observed light emission and the operation characteristics as function of time variation were investigated. Also, we proposed next generation packaging method.
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