P‐54: Effect of Residual Stress on Mechanical Properties of PDP Glass Substrate

Abstract

AbstractWe analyze the effects of thermal mismatch caused by the thermal expansion difference between the dielectric layer and the glass substrate on the breakage of PDP panel. The residual stress and the flexural strength of dielectric layer coated glass substrate were measured with the variation of thermal expansion coefficient of dielectric layer by the addition of ceramic filler. The result of strain viewer suggests that the residual strain of glass substrate near the dielectric layer showed the increase of tensile strain and the other side of the glass showed that of compression strain as the thermal expansion coefficient of dielectric layer decreased. The flexural strength of dielectric layer coated a glass substrate was also influenced by the variation of the thermal expansion coefficient of dielectric layer. The result of the analysis has shown that the thermal mismatch caused by the thermal expansion coefficient difference between the dielectric layer and the glass substrate had an effect on the residual stress and strength of glass substrate, although the thickness of dielectric layer was only a few tens of micro‐meter.