Abstract
To satisfy the full‐screen display demand, we introduce the Sink IC to minimize the bezel of TFT‐LCD module. After study on IC design and optimization of the internal bumps, rationalized design has solved the bonding issues, warping deformation and uneven indentation of Sink IC. The application of Sink IC has promoted the bezel‐less mobile development and the COG precision, which will soon be threw into enterprise production. This essay discusses advantages of the new IC, bonding issues we are trying to solve, and the changes on the panel correspondingly to push Sink IC application in the volume production and display industry.
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