Abstract
At present, the cell structure of common liquid crystal displays generally adopts photolithography process to form post spacers (PS) on the glass substrate in order to maintain the cell gap (CG). The PS formed by this method would have uniform distribution, fixed position and high accuracy. However, the current PS not only requires a separate process, but also a single half‐tone mask in order to form two types of PS heights. The process mentioned above not only increases the manufacturing cost but also reduces the factory capacity. Aiming at the shortcomings of the current PS process, this article shows a design scheme that uses red, green and blue resistance stacks to form PS, referred to as resin PS. [1] This solution completely eliminates the PS process, saves costs, and increases factory production capacity. This paper systematically studied 12 stacking schemes and their effects on the height and size of Resin PS, and realized the step difference control of two resin PS. [2] The verification result found that the color resistance base station increases from bottom to top. The profile structure is relatively stable, as shown in Figure 1. The main PS would adopt a BGR triple stacked structure. The layer of each resin would be thicker, the final size and height would be larger. The sub PS is recommended to use B+G or B+ R dual stacking design, the step difference with the main PS is between 0.6–0.9um, which can be adjusted by the thickness of the hot melt flattening resin (OC); PS Size and height uniformity are good; the elastic recovery rate is 77%, which is closed to Normal PS. In short, the resin PS solution proposed in this paper has outstanding performance in parameters such as high uniformity, size uniformity, M‐S step control, profile, and elasticity, and has great potential to replace normal PS.
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