Abstract
AbstractSmall sized TFT‐panel such as mobile & application product have different mura phenomenon comparing large‐Sized TFT‐panel in ODF(one drop filling) process. Unlike large‐Sized TFT‐panel, for small sized TFT‐panel, push mura and bubble is more serious than gravity mura because portable devices such as mobile & application are sensitive to external shocks. We have developed 1.8”, 2.0” and 2.4” TFT‐panel in ODF process. Through these TFT‐panels, we have developed the PS(post spacer)design rule, process margin and method of material developments that reflect correlation with push mura, bubble and side mura. Through these rules, we suggest PS design rule, process rule and material development in order to optimize mobile & application ODF panel.
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