Abstract
A high‐strength flexible panel capable of high resolution has been studied. The high‐strength and high resolution characteristics have a trade‐off relationship. In this paper, a novel organic trench structure was proposed to satisfy both characteristics at the same time. The novel organic trench structure can prevent the resolution decrease of 26% compared to conventional organic trench structure. In addition, it was confirmed the maximum strain of the fragile inorganic layer was reduced by 7.2% by applying the novel organic trench structure through the simulation. Based on these results, panel with the novel organic trench structure was fabricated and evaluated for the first time. Therefore, we obtained the pen‐drop characteristic increased by more than 2 ㎝ comparing the value of normal panels which are not applied organic trench structure.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
