Abstract
A flexible and stretchable electronic device is an inevitable component to realize wearable and foldable display device. This requires high stability of backplane device operation on flexible substrate upon external mechanical stress such as bending, stretching, and other types of deformation induced stress. Because mechanical stress effects electrical characteristics and degrades the device performance, many researchers have studied the mechanical stress behavior of thin‐film transistor devices on flexible substrates. In this work we present a process simulation model for non‐linear deformation stress. We also demonstrate the validation of the model against publish data.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
