Abstract
In this paper, we propose a device simulation method that quantitatively represents the film profile characteristics. We simulated device characteristics according to pile‐up size and quantitatively confirmed relationship between film profile and device performance. We checked the device characteristics by changing the ratio of the pile‐up area to the planar area in units of pixels and changing the pile‐up stacking thickness. As a result, when ratio of the flat area in active area is 80% or more and the thickness difference is less than 10%, we obtained device efficiency of 90% and more compared to the ideal device (perfectly flat device) for red, green and blue devices. We could also confirm the reliability of the simulation method through device fabrication. And we expect that this study can contribute to improving the characteristics of the panel and device of solution processed OLED.
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