Abstract
AbstractActive Matrix displays on light weight, non‐fragile, plastic substrates are of great interests for portable applications. One of the challenges has been device performance processed at low temperature: in both carrier mobility and operation stability. Another challenge has been bonding‐debonding efficiency. IGZO TFT array was fabricated on a lamination‐based polyimide (PI) flexible substrate at 200°C and is easily debonded without additional equipment. Good electrical characteristic and high stability of the IGZO TFT have been demonstrated.
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