Abstract
Presently reported is the use of plasma fluorination treatment based on tetrafluoromethane to enhance the performance of a p‐type SnO thin‐film transistor (TFT). The improved performance metrics include a larger on/off current ratio, a smaller subthreshold swing and a reduction of an originally large positive turn‐on voltage. The effects of such fluorination treatment were also investigated using a host of thin‐film characterization techniques and their origin most plausibly attributed to both the significant reduction of the carrier concentration from ~2 × 1019 cm−3 to ~4.3 × 1016 cm−3 and the passivation of the defects. It is demonstrated that fluorination is an effective technique for making higher performance p‐type metal‐oxide TFTs.
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