Abstract
A thermo‐stable Debonding layer (DBL) is applied between the glass substrate and polyimide (PI) layer to weaken the adhesion. Through the investigation of the TFT characteristic after mechanical separation under different speed and digging conditions, the optimized process condition has been summarized for the mechanical lift off of the flexible OLED display to avoid inducing more defects.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
