Abstract
PbTi1-xZrxO3 (PZT) thin films prepared by sol-gel method have paid much attention due to the excellent performances in piezoelectric, dielectric, ferroelectric and electro-optical. However, the high crystallization temperature of the PZT thin films restricts the compatibility with modern COMS technology. In this work, PbZr0.52Ti0.48O3 (PZT) ferroelectric thin films were successfully prepared by sol-gel method at an ultra-low temperature (∼450 °C) in an oxygen plasma-assisted environment. A large spontaneous polarization ∼30 μC/cm2 and a large dielectric breakdown ∼2,900 kV/cm were obtained in the sample annealed at 450 °C for 25 h. We believe that the oxygen plasma-assisted ultra-low temperature (OPAULT) annealing process is a promising way for the sol-gel technology applied in the modern COMS devices.
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