Abstract
Oxidation of four typical lead frame copper alloys was investigated. The oxidation rate and adhesion strength of oxide films to copper alloy substrates were studied by measuring the thickness and carrying out peel tests. The results show that, although copper alloys C5191 and C7025 have thinner oxide films, a lower adhesion strength and a higher proportion of CuO were obtained than in the other copper alloys EFTEC64T and C194. The adhesion strength is mainly influenced by the structure of the oxide film of the copper alloys, especially the CuO/Cu2O ratio in the film. The highest adhesion strength is obtained for the copper oxide film with a basic structure of CuO/Cu2O/Cu and a CuO/Cu2O ratio of about 0.1. The segregation of additional elements in the copper alloy plays an important role in the oxide film structure.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
