Abstract
The oxidation of silicon and copper alloyed aluminum thin films in ozonated water was studied. Experiments were performed in a wet bench at different temperatures. The oxidation was studied mainly by optical methods and sheet resistance measurements. The films oxidized only slightly at 5 and 15°C. At 25 and 35°C an oxide film formed faster. The thickness of the oxide as well as the sheet resistance of metal films increased in the course of time. Since ozonated water processing cause only slight oxidation of aluminum thin films it is suggested that this resist removal process can be utilized in integrated circuit processing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
