Abstract
AbstractThe effetzct of the amorphous state and the disordered sputtered state on the oxidation kinetics of nickel films was investigated by a comparison with annealed films and with pure nickel foil and powder. Specimens were exposed to oxygen in a thermogravimetric analyzer (TGA) in the temperature scan mode. An electrodeposited amorphous Ni-P alloy and sputtered pure nickel films were annealed in situ in argon and then oxidized in the same manner as the as deposited films. The as sputtered films oxidized faster at 500%C than pieces of the same film first annealed in argon. Conversely, the as deposited Ni-P film was more oxidation resistant below its crystallization temperature than the annealed Ni-P films.
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