Abstract
The room temperature oxidation of vapour deposited copper films has been investigated as a function of film thickness and time by the sheet resistance and optical transmittance measurements. An increase of both sheet resistance and transmittance with a tendency to saturation has been observed. Time variation of the sheet resistance shows that the kinetics of oxidation could be described by a model whereby an initial logarithmic oxide growth changes to an inverse logarithmic one as time progresses; the thicker the film, the longer the change-over time. Absorption coefficients of oxidized films show that the resulting oxide is most probably Cu2O. Evaluation of the oxidized films for possible use as transparent electrode material shows the existence of an optimum thickness value.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
