Abstract

Stress rupture tests of an Hf-containing Ni-based superalloy with different wall thicknesses were carried out at 760 °C/691 Mpa using the RD-100 electronic machine. At the fracture edge, electron backscatter diffraction (EBSD) analysis showed that recrystallization (RS) occurred, and the width of RS increased with increasing sample thickness. The RS induced the intergranular corrosion cracking and accelerated the failure of the sample. At the interior of the substrate, voids were preferentially nucleated at the site of the Hf(Ta)C carbides, and the thinner sample suffered lighter creep damage than the thicker sample. Consequently, the thinner sample had a superior creep life.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call