Abstract
The oxidation onset and the kinetics of polycrystalline AlN substrates were studied by measuring the weight percent of oxygen in the surface layer and the surface roughness with energy dispersive X-ray spectroscopy (EDX) and atomic force microscopy (AFM), respectively. The oxidation started in the temperature range 800–900 °C and the entire surface of the AlN substrate was covered with an Al2O3 oxide layer below 1100 °C. The oxidation kinetics followed a linear rate law below 1000 °C and a parabolic rate law above 1100 °C. Above 1100 °C, the surface roughness increased abruptly by the irregular shape of overgrown oxide, which might enhance the adhesion of metal to the AlN surface in a metallization process. With an increase of the oxidation temperature above 1200 °C, the oxide layer split during cooling due to the thermal expansion mismatch between the AlN matrix and the Al2O3 oxide layer.
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More From: Journal of Materials Science: Materials in Electronics
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