Abstract
The oxidation behavior of Mo 2Ni 3Si based ternary metal silicide alloy toughened by small amount of nickel-base solid solution (γ) was investigated at 1173 K. The oxide scale was observed to have a duplex structure consisting of a top columnar NiO layer and an internal NiO–SiO 2 mixed layer with continuous SiO 2 formed at its base. The continuous SiO 2 layer made a significant contribution to the low oxidation rate through preventing the diffusion of oxygen and Ni 2+. While, the cracks existing in the oxide scale due to growth stress, thermal stress and volatilization of MoO 3 provided rapid diffusion paths for oxygen and Ni 2+ and deteriorated the alloy's oxidation resistance.
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