Overview of Ceramic Interconnect Technolgy

Abstract

Modern ceramic substrates and packages are sophisticated combinations of glasses, ceramics, and metals that can form compact cost-effective solutions for a variety of applications. Ceramic materials have a long successful history of application in the electronics industry. Ceramic materials offer desirable mechanical and electrical properties for electronics applications. Electrical parameters of interest for the ceramic substrates include volume resistivity, dielectric constant, dissipation factor, and dielectric strength. Mechanical properties of ceramics include mechanical strength and thermal expansion properties. Ceramics, which are brittle materials, must tolerate processing, operation, handling, or storage fatigue, stresses, and microcracking. Ceramic interconnect technologies are commonly used in four major product formats: component, integrated circuit package, functional module, and system-in-package. Ceramic interconnect technology also allows the implementation of electronic products at system levels, producing a system-in-package. Ceramic technology offers advantages for consumer applications requiring proven high reliability, property stability, and very-high-density packaging capabilities.