Abstract
The ESD qualification of the new technologies is obtained by testing different device structures an comparing the ESD robustness evaluated by means of different testing methods (HBM, MM, CDM and TLP). The influence of the layout parameters on the ESD robustness must also be characterized. In this paper we will present data concerning the ESD robustness of both 0.35 μm CMOS and 0.6 μm smart power (BCD5) protection structures. A study of the influence of layout parameters on the ESD robustness with different test methods (HBM, CDM and TLP) will be given. Failure analysis by means of electrical characterization, Emission Microscopy and SEM inspection will also been presented.
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