Abstract
A Co-Cu alloy film having high composition gradient was fabricated by electrodeposition method. The electrodeposition was conducted in the single electrolyte consisting of cobalt sulfate and copper sulfate, in which composition of electrodeposited alloy depends on applied electrochemical potential. The potential was controlled such that the electrodeposited film has a constant composition gradient of 8.0×10^<-4>nm^<-1>. By stacking the films having positive and negative gradients alternately, we could fabricate the high composition-gradient film of pm total thickness. This gradient structure was consistent with the x-ray diffraction analysis that a single broad (111) peak appeared in between the diffraction angles of fcc-Co and Cu crystals. Vickers hardness of the composition gradient film was Hv298, which was certainly higher than that of the Co/Cu multilayered film having 500nm layer thickness. The high strength of the gradient film can be contribute to the misfit dislocations distributing over the film and/or the internal stress arising from lattice constant mismatch.
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