Abstract
OS1-13 Development of Total Inspection of Microscopic Bumps of Semiconductor Component and Golden Component Using Fringe Projection Method(Shape and deformation measurement 2,OS1 Advances in optical methods and techniques,MEASUREMENT METHODS)
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Paper Title
Journal
Date
