Abstract
The purpose of study is to investigate the influence of additional elements on the morphology of interfacial layers after aging. The interfacial reaction layers formed between the low Ag lead-free solders with the additional elements and Cu plate before and after aging were observed by OM and SEM. The addition of Ni was suppressed the growth of the reaction layer compared to SAC107 solder. The addition of Bi and Sb changed finer IMC grains at the reaction layer compared to SAC107 solder. After aging, the reaction layer formed on SAC107 and SAC107 with Bi grew thicker. On the other hands, the addition of Ni or Sb suppressed the growth of the reaction layer.
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