Abstract
This paper investigates theoretically and experimentally the cryogenic fracture behavior of cracked piezoelectric ceramics under electric fields. Fracture tests were performed in three-point bending with the single-edge precracked-beam (SEPB) specimens at room temperature (RT) and liquid nitrogen temperature (77 K), and the fracture loads under electric fields were obtained. Plane strain finite element analysis was also carried out using temperature-dependent material properties of the piezoelectric ceramics, and the dependence of the energy release rate on the electric field and temperature was discussed. In addition, possible mechanisms for cryogenic fracture were examined by scanning electron microscopy (SEM).
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