Origami-inspired sandwich structures under low-to-high velocity impacts: A numerical simulation approach

Abstract

In this study, the ballistic impact performance of sandwich structures with Miura-origami pattern inspired core (MPIC) panels subjected to low-to-high velocity impacts is studied. Sandwich panels with MPIC structure were modeled and finite element analysis was performed using commercially available software LS-DYNA to evaluate their specific energy absorption (SEA) and load-bearing capabilities. A cylindrical indenter (diameter = 10 mm and height = 15 mm) with material property of mild Steel (ρ = 7800 kg/m3) was impacted at three different velocities, i.e., 10 m/s (0.46 J), 50 m/s (11.49 J), 100 m/s (45.95 J) under predefined impact conditions. The obtained results were compared with that of a monolithic solid plate under identical loading conditions and geometrical dimensions. The proposed MPIC design was 93% lighter in weight than the monolithic solid plate. On comparison of stress contours, the monolithic solid plate exhibited regions of high-stress concentration at the impact zone. However, for the MPIC sandwich panel, the stress contour was found to be uniform. For an impact velocity of 100 m/s, the SEA of the MPIC sandwich panel was found to be 1142.6 J/kg, while for the monolithic solid plate, it was obtained as 57.17 J/kg. Eventhough complete penetration of the MPIC sandwich panel occurred for an impact velocity of 100 m/s, the SEA of the MPIC sandwich panels were found to be significantly higher than that of the monolithic solid plate. Since MPIC sandwich panels exhibit enhanced energy dissipation characteristics, they can be an alternative to the conventional monolithic solid plate as light-weight high performance designs for specific applications.