Orientation dependence of the electrochemical corrosion properties of electrodeposited Cu foils

Abstract

In this study, the electrochemical corrosion properties of electrodeposited Cu foils in a CuCl2-containing acidic etching solution were investigated. The main passive product was CuCl and a trace amount of Cu2O can also be detected. The (220)-oriented Cu foils exhibited higher corrosion potential and lower corrosion current density than those with (111) or (200) texture, suggesting a superior corrosion resistance against the etching solution. It is proposed that the preferred orientation and thus the differences in atomic stacking density on specific planes dominated the corrosion properties of the electrodeposited Cu foils instead of grain size or surface roughness.