Abstract
The texture and microstructure of annealed, rolled and recrystallized copper (99.99%) were investigated using conventional X-ray diffraction and single-crystal electron backscattering diffraction (EBSP) in a scanning electron microscope. From the EBSP data, misorientation distribution functions for next neighbor orientation relationships were derived, which show that the undeformed (annealed) starting material and the recrystallized sample have primary and secondary twin correlations, whereas in the deformed sample no preferred misorientations are observed. The microtexture of a single grain with twin lamellae in the deformed sample was analyzed in detail using automated analysis of electron backscattering diffraction patterns. The twin relationship is transformed continuously into a high angle grain boundary during deformation. Orientation gradients within one grain increase steadily up to 20°.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
