Abstract
The article describes organosilicon rapid-curing compositions developed and produced by the State Research Institute of Chemistry and Technology of Organoelement Compounds Institute on pilot scale. Polymers based on these compositions are characterized by superior dielectric properties, water and moisture resistance, and sufficient adhesion to numerous engineering materials; furthermore, they are capable of operating in aggressive environments, in a vacuum, and under the action of shock and thermal loads in the temperature range from −60 (−90) to +200 (+350)°C, and possess chemical and biological inertness. The fields of application of rapid-curing compositions are described. The prospects of developing new materials are considered.
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