Abstract

Defect etching is a well-established method used to reveal different kinds of crystalline defects in semiconducting materials. Most of the etch solutions used today have two disadvantages. They contain hexavalent chromium which is highly toxic and they are not suitable for application on thin films. There is a demand for environmentally friendly etch solutions which can also be used for new materials like SOI. Due to their properties Organic Peracid Etches (OPE), mixtures which contain a short-chain alkanoic acid like acetic or propionic acid, hydrogen peroxide and hydrofluoric acid are suitable for defect delineation in thin and very thin (<50 nm) films. Such solutions were also tested on CZ and FZ silicon substrates. In this case characteristic square-shaped etch figures caused by D-defects (COPs) were found after etching.

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