Ordered high aspect ratio nanopillar formation based on electrical and thermal reflowing of prepatterned thin films

Abstract

Creating well-ordered, submicron-sized pillars have been stated as main limitation for electrically induced patterning of nanofilms (thickness <100 nm) [1]. In our previous works, it was shown that the aspect ratio of formed nanopillars was increased to about 0.35 when thermocapillary induced instabilities (Thermally Induced Patterning, TIP) is combined with electrodynamics instabilities (Electrically Induced Patterning, EIP). However, further reduction of pillar size resulted in a coarse and randomly distributed pillars [2,3]. Here, the reflowing of initially prepatterned nanofilms are examined in the EIP and combined EIP-TIP process to create a well-ordered and high aspect ratio nanopillar arrays without sacrificing the fidelity of the final structure. The long-wave approximation is used to simplify the governing equations and boundary conditions leading to a fourth order nonlinear partial differential equation called thin film equation that describes the spatio-temporal evolution of the interface. The mechanism of pattern reflowing is discussed for both linear (initial) and nonlinear (long-term) deformations in EIP and EIP-TIP process. The optimum initial pattern width, height and the center-to-center distance is found based on the characteristic wavelength for growth of instabilities predicted by linear stability analysis and nonlinear simulation results.