Abstract

SiGe islands have been proposed for applications in the fields of microelectronics, optoelectronics and thermoelectrics. Although most of the works in literature are based on MBE, one of the possible advantages of low-energy plasma-enhanced chemical vapor deposition (LEPECVD) is a wider range of deposition rates, which in turn results in the possibility of growing islands with a high Ge concentration. We will show that LEPECVD can be effectively used for the controlled growth of ordered arrays of SiGe islands. In order to control the nucleation of the islands, patterned Si (001) substrates were obtained by e-beam lithography (EBL) and dry etching. We realized periodic circular pits with diameters ranging from 80 to 300 nm and depths from 65 to 75 nm. Subsequently, thin films (0.8–3.2 nm) of pure Ge were deposited by LEPECVD, resulting in regular and uniform arrays of Ge-rich islands. LEPECVD allowed the use of a wide range of growth rates (0.01–0.1 nm s−1) and substrates temperatures (600–750°C), so that the Ge content of the islands could be varied. Island morphology was characterized by AFM, while μ-Raman was used to analyze the Ge content inside the islands and the composition differences between islands on patterned and unpatterned areas of the substrate.

Highlights

  • Nanostructures for microelectronic applications need to be well controlled in terms of the shape, ordering and composition

  • In order to control the nucleation of the islands, patterned Si (001) substrates were obtained by e-beam lithography (EBL) and dry etching

  • We investigate the impact of the lowenergy plasma-enhanced chemical vapor deposition (LEPECVD) technique on composition and strain relaxation of SiGe islands using AFM and l-Raman spectroscopy

Read more

Summary

Introduction

Nanostructures for microelectronic applications need to be well controlled in terms of the shape, ordering and composition. Since Ge islands tend to nucleate randomly on flat Si substrates, substrate patterning can be used to achieve controlled positioning by creating material traps [1, 2]. Besides positioning the SiGe structures on the substrate, an appropriate pattern can control their size. Using electron beam lithography (EBL), it is possible to vary width, depth and spacing of seed holes in order to trap the deposited material in a controlled way. This method allows strain relaxation in islands to be controlled [3]. The deposition of a few layer of Ge directly on Si-patterned substrates by LEPECVD results in the nucleation of SiGe islands at the preferential sites. We investigate the impact of the LEPECVD technique on composition and strain relaxation of SiGe islands using AFM and l-Raman spectroscopy

Experimental Procedure
Results and Discussion
Conclusions
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.