Abstract

Approximately 4-μm-thick GaN epitaxial films were directly grown onto a GaN/sapphire template, sapphire, Si(111), and Si(100) substrates by high-temperature pulsed laser deposition (PLD). The influence of the substrate type on the crystalline quality, surface morphology, microstructure, and stress states was investigated by X-ray diffraction (XRD), photoluminescence (PL), atomic force microscopy (AFM), transmission electron microscopy (TEM), and Raman spectroscopy. Raman scattering spectral analysis showed a compressive film stress of −0.468 GPa for the GaN/sapphire template, whereas the GaN films on sapphire, Si(111), and Si(100) exhibited a tensile stress of 0.21, 0.177, and 0.081 GPa, respectively. Comparative analysis indicated the growth of very close to stress-free GaN on the Si(100) substrate due to the highly directional energetic precursor migration on the substrate’s surface and the release of stress in the nucleation of GaN films during growth by the high-temperature (1000 °C) operation of PLD. Moreover, TEM images revealed that no significant GaN meltback (Ga–Si) etching process was found in the GaN/Si sample surface. These results indicate that PLD has great potential for developing stress-free GaN templates on different substrates and using them for further application in optoelectronic devices.

Highlights

  • Gallium nitride (GaN) and its related III-nitride materials are excellent wide direct band-gap (3.4 eV) semiconductors due to their potential properties of high saturation velocity in an electric field, high breakdown electric field, and electron mobility—all of which are necessary for the development of next-generation devices and applications that are high frequency, highly efficient, and can effectively power switching devices [1,2,3]

  • PL spectra of GaN grown on different substrates are dominated by the near-band-edge emission at around 360 nm

  • The full width at half maximum (FWHM) of the GaN films produced on samples A

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Summary

Introduction

Gallium nitride (GaN) and its related III-nitride materials are excellent wide direct band-gap (3.4 eV) semiconductors due to their potential properties of high saturation velocity in an electric field, high breakdown electric field, and electron mobility—all of which are necessary for the development of next-generation devices and applications that are high frequency, highly efficient, and can effectively power switching devices [1,2,3]. Due to the lack of suitable native or lattice-matched substrates, GaN epilyers are usually grown on sapphire, SiC, and Si substrates. This presents a serious problem, as a high defect density and a large biaxial stress in the heteroepitaxy of the GaN epilayers are generated by mismatches in the lattice structure and thermal expansion coefficients between the epilayers and the. Substrates that produce a low density of defects present the most effective possible approach for reducing defects in epitaxial films. The crystalline quality, surface morphology, optoelectronic and structural properties related to GaN thick film grown on different substrates as a GaN templates through high-temperature PLD are characterized and compared

Experimental
Results and Discussion
X-ray diffraction of GaN
In film
Raman spectra of GaN films for samples MGS
Residual
Conclusions
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