Abstract
The improvements of communication delay and connectivity by optical interconnection links and multichip module packaging indicate that optoelectronic multichip modules (OE-MCMs) utilizing both technologies will appear in computer systems and communication networks in the near future. However OE-MCM implementation requires seamless integration of electronic and photonic devices and interconnection networks as well as availability of reliable components. In this paper, innovative device structures and fabrication strategies for OE-MCMs are proposed such that they can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize three different technologies (optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies) at the module level and thereby create microoptoelectromechanical systems (MOEMS) which are smart microstructures of photonic, electronic, and mechanical devices and components. This paper addresses the feasibility of the proposed MOEMS through fabrication, assembly, and characterization of OE-MCM prototypes.
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