Optimizing Yield and Wafer Fab Productivity through Yield Sensitive Dispatch

Abstract

Wafer fabrication facilities are under increasing pressure to lower costs while maintaining high yields. This becomes difficult when producing both large and small die on the same equipment. Yielding small die is not a challenge, unlike larger die cannot yield well with high tool particulate levels. To accomplish this, an automated approach to dispatching factory work in progress (WIP) should account for tool and product yield variables. The resulting yield sensitive dispatch maintains high yield across all products while enhancing fab productivity and keeping costs down.