Abstract
Plasmonic contact electrodes are very effective for enhancing the radiation power of photoconductive terahertz sources. Au is a preferred metal for plasmonic contact electrodes due to the high plasmonic enhancement factors it offers in the near-infrared regime. However, Au requires an adhesion layer to stick well to photoconductive substrates. We investigate the impact of the Au adhesion layer on the performance of plasmonic photoconductive sources fabricated on GaAs. Our analysis suggests that Cr is the most suitable adhesion layer, offering up to 80% higher radiated terahertz powers than the previously demonstrated plasmonic sources that use Ti as the adhesion layer.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
