Optimizing Process Parameters on the LGP Molding Stamper Through the Taguchi Method

Abstract

The light guide plate (LGP) is a very important component of the backlight module; however, the electroforming process parameters for making LGP molding stampers are often based on accumulated experience and trial and error, which does not ensure that the set parameters are the best factor level combination and often results in increased manufacturing costs and product defect rates. In this article, eight factors, including boric acid concentration, pH value, temperature, current density, consistency of nickel ion, cathode size, anode size, and stirring speed, were selected by cause-and-effect analysis. Next, the Taguchi method was used to obtain the optimal process parameters in the electroforming process by the minimum number of experiments of the L18 orthogonal array. Finally, through actual process verification, in addition to meeting the target value of the nickel layer thickness of the LGP molding stampers, while improving the surface roughness, dot uniformity, and stress, the accuracy and process robustness are obtained.