Abstract
A response surface methodology only based in this case on computer experiments was used in conjunction with the desirability concept to optimize a priori an electrodeposition process designed for production of gold-tin alloy bumps on a 4 inches wafer. The efficiency of the method was used to achieve at a cheap cost with a small number of computer experiments the technical specifications required in term of metal deposit thickness uniformity.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
