Abstract
Printing nano-ink with platinum nanoparticles to generate conductive microstructures for electronics on different types of substrates has gained increasing interest in recent years. To solve the problem of the low conductivity of platinum (Pt) nano-ink, we synthesized chemically pure Pt nanoparticles with sizes of 18.2 ± 9.0 nm by spark discharge method. A low toxic solvent, ethylene glycol with water, was used to ensure the aggregation stability of Pt nanoparticles. Polyvinylpyrrolidone was used as an adhesive additive and binder in the nano-ink. Narrow and conductive Pt lines were generated by aerosol jet printing technology. The resistivity of the Pt lines sintered at 750 °C on alumina substrate was found to exceed the bulk Pt by about 13%. Moreover, the Pt film fabricated on polymer substrates has demonstrated excellent mechanical flexibility in terms of twisting tests.
Highlights
In recent years, printing processes have gained interest as a means of making costeffective electronic circuits and devices [1,2]
We focused on investigating the effect of aerosol jet printing and sintering process parameters on the geometry and resistivity of printed platinum lines
The ink is characterized by the following basic parameters for compatibility with aerosol jet printing system: platinum nanoparticles concentration 25 wt%, viscosity 11 cP, and surface tension 44 mN/m
Summary
In recent years, printing processes have gained interest as a means of making costeffective electronic circuits and devices [1,2]. The limited choice of substrate materials, the high cost, and the time-consuming manufacture of electronic devices led to the development of technologies such as screen printing, inkjet printing, gravure printing, and aerosol jet printing [5,6,7,8]. In order to form a high density of elements in the circuit, it is necessary to ensure the minimum size of structures in the range from 10 to 30 microns [16,20] From this point of view, aerosol jet printing is the most promising method, since it allows the formation of functional microstructures with lateral dimensions of the order of 10 μm on various substrate materials, including flexible polymer substrates [21,22,23,24]
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