Abstract
Three dimensional integration is considered as a very promising technology for integrated circuit design. However, the ensuing thermal issues have posed threat to further development of Three-dimensional integrated circuits (3-D ICs).Cooling 3-D ICs with thermal through silicon vias (TTSVs) is well known. In this work we utilize time dependent temperature fluctuation in active layers of 3D IC and convert it to electrical energy using pyroelectric effect. We propose novel TTSV structure modification so that TTSVs can be used for both on chip energy harvesting and heat mitigation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
