Abstract
Strong glass/solder/metal seals were prepared between float glass, tin solder and Fe-Ni alloys by the Activated Liquid Tin Solder Anodic Bonding (ALTSAB) process that combines classical anodic bonding with a liquid solder to ensure a near perfect contact between the bonding surfaces. The optimization of the Al content of the solder enables the production of glass/solder/metal joints without pre-treatment of the metal or glass surfaces. Strong glass/solder bonds are formed by anodic bonding across the oxide/metal interface and strong solder/metal bonds are formed simultaneously by soft soldering. The combined process consists of two very different processes and the optimal solder composition represents the middle ground between the requirements for both interfaces. The glass/solder bond strength increases with increasing Al content at the expense of the solder/metal bond strength: solders with a very low Al content of 75ppm constitute the best compromise and result in the strongest glass/solder/metal joints. The optimal solder composition was used to anodically bond Dilaton Fe-48wt%Ni frames to the edge of 500×500mm2 float glass panes for vacuum glazing applications.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
