Abstract

Effects of RF power on optical, electrical, and structural properties ofμc-Si1−xGex:H films was reported. Raman and FTIR spectra fromμc-Si1−xGex:H films reflected the variation in microstructure and bonding configuration. Unlike increasing the germane concentration for Ge incorporation, low RF power enhanced Ge incorporation efficiency inμc-Si1−xGex:H alloy. By decreasing RF power from 100 to 50 W at a fixed reactant gas ratio, the optical bandgap ofμc-Si1−xGex:H was reduced owing to the increase in Ge content from 11.2 to 23.8 at.%, while Ge-related defects and amorphous phase were increased. Consequently, photo conductivity of 1.62 × 10−5 S/cm was obtained for theμc-Si1−xGex:H film deposited at 60 W. By applying 0.9 μm thickμc-Si1−xGex:H absorber withXCof 48% and [Ge] of 16.4 at.% in the single-junction cell, efficiency of 6.18% was obtained. The long-wavelength response ofμc-Si1−xGex:H cell was significantly enhanced compared with theμc-Si:H cell. In the case of tandem cells, 0.24 μm a-Si:H/0.9 μmμc-Si1−xGex:H tandem cell exhibited a comparable spectral response as 0.24 μm a-Si:H/1.4 μmμc-Si:H tandem cell and achieved an efficiency of 9.44%.

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