Abstract
The solder technology on printed-circuit-board (PCB) industry is one of key roles to provide the high-yield assembly. In this work, we investigated the soldering temperature impacting the solderability on PCB with PCB layout patterns to optimize the solderability on PCB. The inner copper diameters of solder-pin holes, the space between the exterior contour of the inner core and the interior of the boundless copper, the plural petal patterns of solder points and the width of the petals were taken into concern as well. Indeed, not all of parameters were quantitatively increased, then, the solderability was linearly increased, too. If the soldering temperature is able to be concentrated on the solder point, the solder material is not quickly frozen. Therefore, the surrounding area neighboring the solder point is relatively lower. This result indicates that the solderability quality on PCB is better.
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